英特尔（成都）- 公共事务实习生

SuperDons

Title: 812945- China Public Affairs Intern (Chengdu Site)
Location: Chengdu
6 @; d% g  F4 ?( }/ ]' hContact:  kim.fung.chong@intel.com
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" e( h* s  e# s* M7 V9 q8 ]Description:

3 W' @9 @2 J+ BWe give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth.
As a global leader in innovation and new technology, we foster a collaborative, supportive, and boredom-free environment-where the brightest minds in the world come together to achieve exceptional results.
6 U$ N3 j6 \- T! WWe provide benefits that promote a healthy, enjoyable life and many more creative perks that make Intel a Great Place to Work!
We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today.

$ ?( I( A  b' X. b6 T$ jMinimum Qualification Skills (Must Have Skills):
1.Candidate must be a postgraduate student of business management, public administration, journalism, graphic design, multimedia/advertising, or communication degree.
: @5 o7 V* G0 _) \) w+ H  Q2.Strong written communication skills in English and Mandarin with good conversational English language.
3.Candidates should possess strong computer skills with the ability to learn new systems (e.g. Microsoft Windows, Microsoft Office suite).
4.Good IT skill in webpage development and Photoshop.

Preferred Skills (Nice to Have Skills):
1.Candidate who has an engineering technical background is a plus.
2.Experience in writing and editing experience is an advantage.
/ v  o, Z$ t/ O2 Z! W! N; o3.Ability to work effectively in a demanding environment and tight schedule;
4.Judgment and decision making ability is required in resolving moderately complex problems;
+ @' g5 p0 B, K" I" W: [+ S  E5.A good team player with high energy and enthusiasm.
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If you're interested in this position, please join us! Please subject your email as ‘China Public Affairs intern (Chengdu)  _XX days per week_XX months’ to kim.fung.chong@intel.com .

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